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authorIsaac Chen <ycchen@google.com>2017-05-10 19:02:20 +0800
committerIsaac Chen <ycchen@google.com>2017-05-12 11:13:19 +0800
commit8d434ca2a7e3522f1cea34ded314edb801a6bc19 (patch)
tree253786012b5b6ee2703dea136c6b5a337002c0f9 /CleanSpec.mk
parent22fe568c04ec644cb9e7f6673cfbd08ee927b88b (diff)
Move configuration files to vendor for build split
The following configuration files need to reside in vendor partition to work with generic AOSP system image. Move uevent.*.rc to /vendor Move fstab.* to /vendor/etc Move init.*.rc and init.wahoo.usb.rc to /vendor/etc/init. Also the following two make file variables need to be set: - BOARD_PROPERTY_OVERRIDES_SPLIT_ENABLED := true - PRODUCT_ENFORCE_RRO_TARGETS := framework-res Comment out "import init.wahoo.usb.sh" in init.common.usb.rc since /init will load all rc files under /vendor/etc/init. Bug: 37927875 Test: These files are under /vendor instead of / or /system, path in init.common.usb.rc is changed to vendor accordingly, and the resulted system/vendor images work on the device. Change-Id: I63e18860eed9330e0d7b53b3df09483f2bfce5ea
Diffstat (limited to 'CleanSpec.mk')
-rw-r--r--CleanSpec.mk3
1 files changed, 3 insertions, 0 deletions
diff --git a/CleanSpec.mk b/CleanSpec.mk
index b6200a2..2d93395 100644
--- a/CleanSpec.mk
+++ b/CleanSpec.mk
@@ -49,3 +49,6 @@ $(call add-clean-step, rm -rf $(PRODUCT_OUT)/vendor)
$(call add-clean-step, rm -rf $(OUT_DIR)/target/product/muskie/vendor/etc/sensors/sensor_def_qcomdev.conf)
$(call add-clean-step, rm -rf $(OUT_DIR)/target/product/walleye/vendor/etc/sensors/sensor_def_qcomdev.conf)
+
+$(call add-clean-step, rm -rf $(PRODUCT_OUT)/root/init.$(PRODUCT_HARDWARE).logging.rc)
+$(call add-clean-step, rm -rf $(PRODUCT_OUT)/root/init.$(PRODUCT_HARDWARE).usb.rc)